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Back grinding machine IVG-2030 for Si, SiC, GaAs, InP, Sapphire, LED, and other conductor and semiconductor

Back grinding machine IVG-2030 for Si, SiC, GaAs, InP, Sapphire, LED, and other conductor and semiconductor

    • Back grinding machine IVG-2030 for Si, SiC, GaAs, InP, Sapphire, LED, and other conductor and semiconductor
    • Back grinding machine IVG-2030 for Si, SiC, GaAs, InP, Sapphire, LED, and other conductor and semiconductor
    • Back grinding machine IVG-2030 for Si, SiC, GaAs, InP, Sapphire, LED, and other conductor and semiconductor
    • Back grinding machine IVG-2030 for Si, SiC, GaAs, InP, Sapphire, LED, and other conductor and semiconductor
    • Back grinding machine IVG-2030 for Si, SiC, GaAs, InP, Sapphire, LED, and other conductor and semiconductor
  • Back grinding machine IVG-2030 for Si, SiC, GaAs, InP, Sapphire, LED, and other conductor and semiconductor

    Product Details:

    Place of Origin: South Korea
    Brand Name: HIB
    Certification: ISO, CE
    Model Number: IVG-2030

    Payment & Shipping Terms:

    Minimum Order Quantity: 1 set
    Price: USD 50000-250000 per Set
    Packaging Details: Wooden cases
    Delivery Time: 30-60 days
    Supply Ability: 10 sets per month
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    Detailed Product Description
    Wheel Size: Ø203(OD)mm Cup Type Max Work Piece Size: Ø200mm
    Accuracy: ±0.001 Mm Travel Length: 130 Mm
    Feed Speed: 0.01um ~ 1000 Um/sec Chuck Type: Vacuum Chuck

    KSHS Back Grinding Machines

     

    Model: IVG-5030, 3030, 2030

    IVG-2035

    IVG-3040F, J

     

    Back grinding machine IVG-2030 for Si, SiC, GaAs, InP, Sapphire, LED, and other conductor and semiconductor

     

    Features:

     

    • High Strength Structure of Casting Body
    • High Precision and High Rigidity Linear System
    • Maximize user convenience with PC Base system
    • Automatic On-line Detection System
    • Automatic dressing system
    • Automatic storage and query confirmation of processing records and parameters
    • Data Sorting (The parameters can be stored as Excel files)
    • Bar code Reader & Addition functions (Option)
    • MES or SECS/GEM Realizable (Option)

     

     

    Technical specifications:

     

      IVG-5030 (20”) IVG-3030 (12”) IVG-2030 (8”)
    Wheel Spindle 12.2kW / 3000rpm 9.5kW / 4000rpm 6kW / 6000rpm
    Work Spindle 2.0kW / 260rpm 1.5kW / 260rpm 0.75kW / 400rpm
    Work Table Size Diameter 500mm Diameter 300mm Diameter 200mm
    Wheel Size 375mm 303mm 203mm
    Grinding Speed 0.0001mm~30.0000mm 0.0001mm~30.0000mm 0.0001mm~30.0000mm
    Resolution 0.0001mm 0.0001mm 0.0001mm
    Grinding TTV (Si Wafer) ±0.003mm ±0.002mm ±0.0015mm
    Automatic Measuring System 2 Probe / 0.1um / 5mm 2 Probe / 0.1um / 5mm 2 Probe / 0.1um / 5mm
    Automatic Dressing System 400rpm / 200W / ø90*30mm 400rpm / 200W / ø90*30mm 400rpm / 200W / ø90*30mm
    MES or SECS/GEM User Spec. (Optional Item) User Spec. (Optional Item) User Spec. (Optional Item)
    Machine Size

    1100 x 1400 x 2070 (IVG-5030)

    1000 x 1400 x 2070 (IVG-5020)

    1000 x 1400 x 2070 900 x 1400 x 2000
    Machine Weight

    2500 Kg (IVG-5030)

    2300 Kg (IVG-5020)

    2200 Kg 1900 Kg

     

     

    Grinding Process:

     

    Back grinding machine IVG-2030 for Si, SiC, GaAs, InP, Sapphire, LED, and other conductor and semiconductor

     

     

    Applications:

     

    Wafers of different maetials, such as Si, SiC, GaAs, InP, Sapphire, LED, and other conductor and semiconductor, etc.

     

    Workpiece examples:

     

    Back grinding machine IVG-2030 for Si, SiC, GaAs, InP, Sapphire, LED, and other conductor and semiconductor

     

    Back grinding machine IVG-2030 for Si, SiC, GaAs, InP, Sapphire, LED, and other conductor and semiconductor

     

    Origion: South Korea

    Delivery time: 1-3 Months

     

    For more details, please contact Ms. Sherry directly:

    Email:trade2(@)grindingchina.com; sherry_turbo(@)hotmail.com

    Skype: sherryturbo Wechat: 13439735750

    Contact Details
     Beijing Kai Shuo Heng Sheng Technology Co., Ltd

    Contact Person: Ms. Sherry Palace

    Tel: 86-10-6572-9550

    Fax: 86-10-8863-2570

    Send your inquiry directly to us (0 / 3000)

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